2020

• 10

  Oct. Developed 5G Ni-less process

• 10

  Oct. Developed SAP, mSAP flash etchant

• 09

  Sept. Developed sulfuric acid free horizontal degreaser

• 07

  July. Developed EDTA type horizontal chemical copper

2019

• 09

  Sept. Developed additives to via fill Electrolytic copper

• 08

  Aug. Developed vertical chemical copper for HA Copper Foil

2018

• 11

  Nov. Developed LCP copper plating process PCB

• 01

  Jan. Developed selective metal etchant for TSP Vezelless

2017

• 10

  Oct. Developed chemicals for semi-conductor post process (UBM, RDL Etchant)

• 06

  June. Developed electroless chemical copper for RA&HA copper foil

2016

• 10

  Oct. Developed eco-friendly flux cleaner

• 08

  Aug. Developed LDS plating process chemicals

• 05

  May. Developed thermosetting PSR etchant (Laz Process) for ultra-thin packages

2015

• 10

  Oct. Developed ultra-thin electroless copper foil

2014

• 11

  Nov. Developed Via Fill cathode copper plating chemicals

• 05

  May. Developed electroless chemical copper plating chemicals

2013

• 07

  July. Developed conductive polymer chemicals

2012

• 10

  Oct. Developed electroless reduction gold plating chemicals for lead-frame

• 06

  June. Developed alloy electroplating chemicals

2011

• 10

  Oct. Developed electrolytic nickel tungsten gold plating chemicals and ENEPIG electroless reduction gold plating chemicals

2010

• 12

  Dec. Developed Aluminum metal PCB etchant

• 11

  Nov. Developed wire bondable ENIG chemicals

• 10

  Oct.. Developed right angle etching additives for fine patterned PCB

• 09

  Sept. Developed pretreatment agent for chemical strengthening of TSP glass

• 08

  Aug. Developed cyanide free type immersion gold chemicals

• 04

  Apr. Developed D/F stripper for MSAP

2009

• 12

  Dec. Developed ITO etching chemicals

• 09

  Sept. Developed soft ENEPIG process chemicals

2008

• 04

  Apr. Developed electroless nickel immersion silver/palladium plating process (Ag-Pd)

• 03

  Mar. Developed high-ductile electroless nickel-gold plating process

2007

• 11

  Nov. Completed the development project for component and material technology (Developed cathode copper plating solution electroless nickel/palladium/gold plating process (ENEPIG) 
  

• 10

  Oct. Developed electroless nickel-gold plating chemicals and process

2006

• 05

  May. Developed plating solution of electroless nickel immersion silver

2005

• 12

  Dec. Acquired approval for DUOTOP process (By Samsung Electronics)

2004

• 09

  Sept. Developed electroless nickel immersion silver/gold plating process (DUOTOP Process)

2003

• 01

  Jan. Developed plating solution for electroless nickel immersion tin

2002

• 04

  Apr. Developed local manufacturing of formalin-free and electroless copper plating solution for semi-conductor D-RAM

2001

• 04

  Apr. Developed photoresist stripper

2000

• 10

  Oct. Developed half etching chemicals

1999

• 02

  Feb. Developed Mass-Lam chemicals