HOME- R&D
- Current Development Status
Current Development Status Through consistent R&D and supply of diverse products, YMT Research Institute develops/secures expertise in the material solution industry such as PCB, semi-conductor, and electronic materials and responds to customer needs.
R&D
PCB Business
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- Finish Plating
Chemical
- Finish Plating
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- Copper Plating
Chemical
- Copper Plating
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- Process
Chemical
- Process
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- Finish Plating Chemical
- Electroless platingSoft ENIG, ENIG, ENEPIG(Pd-P, Pure Pd), electroless Tin
- ElectroplatingHard Gold, Soft Gold, electro Tin
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- Copper Plating Chemical
- Desmear
- Chemical copper (vertical, horizontal)
- Electrolytic copper
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- Process / Display Chemical
- Process chemicalsMSAP stripper, Flux cleaner, Gold Recover, Cu etchant
- Display chemicals Metal etchant, Cu&Ti etchant, ITO etchant
Material Solution Business
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- Electronic
Material
- Electronic
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- Semi Conductor
Chemical
- Semi Conductor
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- Electronic Material
- Ultra thin copper foil
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- Semi Conductor Chemical
- Bump process chemicalCu & Ti Etchant series Au etchant series
- MEMS process ChemicalNiCr etchant series
- TSV Process ChemicalPost Dry etch cleaner