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Product Information

Final Surface Treatment The process used for the final treatment of electronic materials such as PCB and semi-conductor. It mainly uses chemical materials such as gold, silver, and palladium for jewelry plating.

Soft ENIG Process

  • Gold plating process for FPCB
  • Can implement ultra-fine circuit
  • Excellent folding endurance
  • Reduce nickel cracks

ENEPIG Process

  • Final surface treatment for fine circuits suitable for camera modules and the like
  • Secure cost and technical competitiveness

Soft ENIG Process : CF300-10 series / MIKO series

  • Features

    • Excellent bendability with columnar micro-structure of electroless Nickel
    • Uniform bendability and excellent bath stability up to 3 MTO
    • Plating process with less Ni corrosion

    • Pretreatment

    • Soft EN : CF300-10 series

    • Immersion Gold :
      Miko series

  • After 50 cycle-bending

Pd-P(ELP series) or Pure Pd(ZEP series) ENEPIG Process

  • Features

    • Surface finishing compatible to both wire bonding and soldering
    • Selectively adoptable among Pd-P or Pure Pd

  • Plating process

Electrolytic Gold Process : HG300 & SAU10 series

  • Hard gold process features

    • Excellent corrosion resistance and abrasion property
    • Suitable for memory module and connect parts

  • Plating process

    • Cleaner

    • Etching

    • Acid Dip

    • Bright Ni

    • Acid Dip

    • Au Str.

    • Au

  • Soft gold process Features

    • Good Wire bonding and solderability
    • Minimized immersion plating
    • Grain size controlled by grain refiner