Electroless Copper Plating
- The world-class technical power
- A process that assigns chemical conductivity to noncondensing substances
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Product Information
Copper Plating Chemical materials for processing that enable electric connection between floors by copper plating of holes processed by drills
PCB Hole
Electrolytic Copper Plating
- A process of copper plating with the desired thickness by copper extraction
- Suitable for setting the position and thickness
- Excellent in maintaining uniform plating thickness compared to competitive products
Vertical & Horizontal Electroless Cu Process : HVF EL-Cu series
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Features
- Applicable to various products such as PKG, HDI, FPCB, and RF-PCB etc.
- Excellent coverage and high throwing-power on Through-hole and Via-hole
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Excellent Coverage on Various Materials
Via Fill Electrolytic Copper Additives : VFBJ series
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Features
- Cu Filling available with a thin layer ㅣ Increasing productivity by high current density
- Excellent via filling ㅣ Using insoluble anode
- Improved reliability/Tensile strength, Elongation ㅣ Precisely analyzed by CVS
Plating
- 1.6ASD/60min
- Via diameter
- 120㎛
- Via depth
- 60㎛
